现在就让我们一起来回顾一下Intel和AMD今年的新主板芯片组吧。
点击前往2020年度回顾目录
Intel平台
今年Intel推出的第十代酷睿处理器把接口换成LGA 1200，并同步推出了400系芯片组，包括Z490、H470、B460和H410。
预览var tableid = settableid();
document.write('');
Table().init({
title: "Intel 400/300系列规格参数对比",
header: ["型号", "Z490","H470","B460","H410","Z390","H370","B360","H310"],
width: '92%',
columnWidth: 'MAX', //表格单元宽度，"MAX"最大内容显示，""AVG"平均，"AUTO"自动，指定[15,16,20]
id: tableid,
data: [
["CPU接口","LGA 1200","LGA 1200","LGA 1200","LGA 1200","LGA 1151","LGA 1151","LGA 1151","LGA 1151"],
["超频","√","×","×","×","√","×","×","×"],
["DMI总线版本","3.0","3.0","3.0","3.0","3.0","3.0","3.0","2.0"],
["每通道DIMM数量","2","2","2","1","2","2","2","1"],
["显示输出数量","3","3","3","2","3","3","3","2"],
["PCI-E 3.0通道数","24","20","16","6","24","20","12","6"],
["CPU PCI-E配置","1x162x81x8+2x4","1x16","1x16","1x16","1x162x81x8+2x4","1x16","1x16","1x16"],
["USB接口数量","14","14","12","10","14","14","12","10"],
["USB 3.2接口","最大6个USB 3.2 Gen 2最大10个USB 3.2 Gen 1","最大4个USB 3.2 Gen 2最大8个USB 3.2 Gen 1","最大8个USB 3.2 Gen 1","最大4个USB 3.2 Gen 1","最大6个USB 3.2 Gen 2最大10个USB 3.2 Gen 1","最大4个USB 3.2 Gen 2最大8个USB 3.2 Gen 1","最大4个USB 3.2 Gen 2最大6个USB 3.2 Gen 1","最大4个USB 3.2 Gen 1"],
["SATA 6Gbps","6","6","6","4","6","6","6","4"],
["RAID支持","0,1,5,10","0,1,5,10","0,1,5,10","N/A","0,1,5,10","0,1,5,10","0,1,5,10","N/A"],
["整合无线网卡","Wi-Fi 6","Wi-Fi 6","Wi-Fi 6","N/A","Wi-Fi 5","Wi-Fi 5","Wi-Fi 5","N/A"],
["傲腾内存支持","√","√","√","×","√","√","√","×"],
["TDP","6W","6W","6W","6W","6W","6W","6W","6W"]
]
});光看规格的话Z490、H470与Z390、H370差别并不大，B460与B360相比PCI-E通道数从12条增加到了16条，但USB 3.2 Gen
2的支持直接被砍了，H410的DMI也升级到了3.0，此前H310用的还是DMI 2.0。
新的主板其实有许多新特性在搭配Comet Lake-S处理器时是发挥不出来的，比如PCI-E 4.0，还有就是PCH其实从上代开始就已经升级到了DMI
3.0 x8接口，但原本搭配的Cannon Lake处理器胎死腹中，后面的一票Coffee Lake和Comet
Lake都是沿用Skylake架构，DMI只有3.0 x4带宽，得等到明年的Rocket Lake-S处理器到来才能解放Intel
400系主板的全部特性，现在的Comet Lake从各种意义上都有很浓重的过度气息。
预览var istart = 1; //通过编号生成，图片开始的编号，不强求连续，但尽量连续编号，小图+s，如1s；
var istart=['Z490','Z390']; //通过文件名生成，大图文件名，不含后缀，小图以s结尾
var ilast = 8; //结束图片的编号，如果是文件名生成，这个数字不用改
var tips = []; //图片说明，按顺序列，没有就空着
var iurl = "https://img.expreview.com/review/2020/05/Core_i9_10900K/"; //图片目录
var col = 2; //列数，一排几张图，1 2 3 4可选
var nomore = 0; //大小图是否一样，1为一样，不需要s后缀的小图，用于列图片
var gap = 0; //图片间距修正，默认0
var bd = 0; //描边，0或1，默认0
var full = 0; //是否全屏，0 或 1
var pic = ".jpg"; //图片格式
WaterInit(pic, iurl, col, gap, bd, istart, ilast, full, tips, nomore);看方块图的话，Z490与Z390相比主要是在网络方面进行了升级，整合的CNVi无线网卡从WiFi 5升级到WiFi
6，厂家只需要选配对应的射频模块就能提供最新的Wi-Fi
6无线网络。而且400系主板2.5G有线网卡成了可选配件，基本上所有Z490主板都用上了2.5G网卡，部分B460主板也有配备，但Intel并没有指定网卡型号，所以Intel和Realtek的2.5G网卡都可能在400系主板上看到。
Z490比起Z390供电相数很明显增加了，因为第十代酷睿的最大核心数量从8个增加到10个，频率也高了，酷睿i9的PL2高达250W，在制程与架构都不变的情况下功耗必然增加，在加上Z490设计时还需要考虑到超频后的状况，供电冗余肯定要留多一些，增加相数的话也有助于降低每一相供电的发热，让VRM部分热量分布更平均，当然这也得看具体的用料。
AMD平台
AMD这边今年推出了全新架构的Zen 3处理器，但并没有AMD
600系芯片组，现在的旗舰芯片组依然是X570，今年推出的B550与A520芯片是面向主流与入门平台的，入门级的A520主板由于不支持超频，也不支持PCI-E
4.0所以玩不出什么花样出来。但B550就不一样了，它支持超频，支持CPU的PCI-E
4.0，也支持双显卡，所以主板厂都在B550大做文章，堆供电堆用料，甚至做出了2、3千元的B550出来。
预览var tableid = settableid();
document.write('');
Table().init({
title: "AMD 500/400系列规格参数对比",
header: ["型号", "X570","B550","A520","X470","B450","A320"],
width: '92%',
columnWidth: 'MAX', //表格单元宽度，"MAX"最大内容显示，""AVG"平均，"AUTO"自动，指定[15,16,20]
id: tableid,
data: [
["CPU接口","Socket AM4",],
["超频","√","√","×","√","√","×"],
["每通道DIMM数量","2",],
["CPU可用PCI-E通道数（最多）","20条PCI-E 4.0","20条PCI-E 4.0","20条PCI-E 3.0","20条PCI-E 3.0","20条PCI-E 3.0","20条PCI-E 3.0"],
["FCH可用PCI-E通道数（最多）","16条PCI-E 4.0","10条PCI-E 3.0","6条PCI-E 3.0","8条PCI-E 2.0","6条PCI-E 2.0","4条PCI-E 2.0"],
["CPU PCI-E配置","1×162×81×8+2×4","1×162×81×8+2×4","1×16","1×162×81×8+2×4","1×16","1×16"],
["USB接口数量（最多）","16","14","13","18","14","13"],
["USB芯片组（最多）","12个USB 3.2 Gen 24个USB 2.0","6个USB 3.2 Gen 22个USB 3.2 Gen 16个USB 2.0","5个USB 3.2 Gen 22个USB 3.2 Gen 16个USB 2.0","2个USB 3.1 Gen 210个USB 3.1 Gen 16个USB 2.0","2个USB 3.1 Gen 26个USB 3.1 Gen 16个USB 2.0","1个USB 3.1 Gen 26个USB 3.1 Gen 16个USB 2.0"],
["SATA 6Gbps（最多）","14","8","6","10","6","6"],
["RAID支持","0,1,10",],
]
});其实从上面的表格就能看得出，B550的规格其实是强于上一代的X470的，所以真是能玩出不少花样，但消费者买不买帐就另一回事。B550/A520提供的另一个明显的升级就是南桥提供的PCI-E通道也从2.0全面升级到了3.0，意味着不论是网卡还是WiFi网卡等的装置都可以用PCI-E
3.0来运作。不过最大的得益者仍然是SSD，因为M.2 NVME SSD在PCI-E 3.0之下的体验对比起在PCI-E 2.0之下的差异是巨大的。
此外由于AMD 500系主板只需要考虑兼容Zen 2与Zen 3处理器，所以CPU所提供的4个USB接口可以直接做成USB 3.2 Gen
2规格的，高速USB接口数据比上带大幅增加，当然实际做成什么接口还得看主板厂对具体主板的定位。
此外由于比X570要晚一年，所以不少B550主板用料都比同价位的X570更好，而且许多B550主板都跟风上了2.5G网卡，这些是许多X570都没有的，新款的X570少之又少，去年旗舰级的X570主板规格还是要比B550好不少的，但千元级的X570供电用料不如B550的比比皆是，怎么选是一个很困难的问题。X570的扩展能力要比B550好得多，毕竟南桥支持PCI-E
4.0并且有更多的通道，至于供电和网卡这东西就要看你是否真的需要了，毕竟X570本身的供电也不会差，2.5G网卡现在也不是必须的东西。
点击前往2020年度回顾目录
